Because of the glass fiber multilayer circuit board in desoldering Yang of cooling speed is in the process of operation, to spare desoldering caused some difficulties in operation under the condition of: in this paper, we introduce a kind does not have under the condition of professional tools, rapid non-destructive desoldering glass fiber multi-layer circuit boards of various large-scale Ic, components, sockets, socket method.
A, all the tools:
Honeycomb briquet piece, high temperature tape, welding bench temperature soldering iron, washing water, medical needles.
Second, to unsolder the computer motherboard BIOS, for example:
1. On the back of the BIOS is the main board on the back) (with high temperature tape around the post, leaving only the BIOS is not posted on the back. Medical needle is installed on the disposable chopsticks.
2. Light honeycomb briquet, when combustion is out from the furnace, flat on the ground for a minute or two. Must see flame descended to such as are the next steps.
3. The motherboard BIOS honeycomb briquet placed on the back is 3 ~ 5 cm above the center, to center moving evenly heating the mainboard.
4. Wait 30 seconds on a board solder melts, the BIOS with the needle gently picked out, to the main pull the BIOS of the solder tin coating processing, clean with water washing plate motherboard can complete desoldering.
Loading of the new BIOS method: heating board, plate bonding pad on the solder melts, technicians to pass the tin new BIOS alignment pins labeled, extend the heat for 5 seconds, can complete SMT.
Note. The above desoldering operation, circuit board must remain above the honeycomb briquet, in case the cooling circuit board. For circuit boards, after the completion of desoldering can clean with washing plate water cooling.
This kind of method for desoldering glass fiber more boards are extremely effective, repeatedly desoldering large-scale IC, with hot irons to make tow tin pin first treatment effect is better. False welding can also deal with BGA chip in this law, but to the BGA pins after injection of rosin water heating again. This false repair BGA welding method has certain risk. Use caution.
Special remind, this article introduces the desoldering method is only applicable to glass fiber multilayer circuit board, because of its very excellent high mechanical strength, high heat and high temperature resistant performance. Ordinary single bakelite circuit board repeatedly not high temperature resistant, easy to cause deformation of circuit board in this way, blister, burn out seriously damaged. Thinner double-sided glass fiber board also should pay attention to when using this method the heating time, in case of high temperature deformation of circuit board.
A, all the tools:
Honeycomb briquet piece, high temperature tape, welding bench temperature soldering iron, washing water, medical needles.
Second, to unsolder the computer motherboard BIOS, for example:
1. On the back of the BIOS is the main board on the back) (with high temperature tape around the post, leaving only the BIOS is not posted on the back. Medical needle is installed on the disposable chopsticks.
2. Light honeycomb briquet, when combustion is out from the furnace, flat on the ground for a minute or two. Must see flame descended to such as are the next steps.
3. The motherboard BIOS honeycomb briquet placed on the back is 3 ~ 5 cm above the center, to center moving evenly heating the mainboard.
4. Wait 30 seconds on a board solder melts, the BIOS with the needle gently picked out, to the main pull the BIOS of the solder tin coating processing, clean with water washing plate motherboard can complete desoldering.
Loading of the new BIOS method: heating board, plate bonding pad on the solder melts, technicians to pass the tin new BIOS alignment pins labeled, extend the heat for 5 seconds, can complete SMT.
Note. The above desoldering operation, circuit board must remain above the honeycomb briquet, in case the cooling circuit board. For circuit boards, after the completion of desoldering can clean with washing plate water cooling.
This kind of method for desoldering glass fiber more boards are extremely effective, repeatedly desoldering large-scale IC, with hot irons to make tow tin pin first treatment effect is better. False welding can also deal with BGA chip in this law, but to the BGA pins after injection of rosin water heating again. This false repair BGA welding method has certain risk. Use caution.
Special remind, this article introduces the desoldering method is only applicable to glass fiber multilayer circuit board, because of its very excellent high mechanical strength, high heat and high temperature resistant performance. Ordinary single bakelite circuit board repeatedly not high temperature resistant, easy to cause deformation of circuit board in this way, blister, burn out seriously damaged. Thinner double-sided glass fiber board also should pay attention to when using this method the heating time, in case of high temperature deformation of circuit board.