In recent years, due to the continuous development of solid-state light source technology, makes the LED luminous efficiency, will gradually replace the traditional light source, the luminous efficiency than incandescent and halogen lamps and continuous development, with the development of high efficiency LED components through 100lm/W, the application of LED lighting is not limited to the indoor, outdoor lighting, mobile phone gradually to backlight module and the direction of the vehicle lamp extends.
In view of the merits of LED energy saving, environmental protection and long service life, taking LED as lighting source has become the new trend of China's lighting field. In order to make the luminous efficiency of LED is higher, need to enter a higher power, and the current high power LED photoelectric conversion efficiency value is only 15% ~ 25% output power into light, other are converted into heat. LED chip has the advantages of small size, poor radiation effect, resulting in high power LED heat use per unit area, even more than IC elements in general is still higher, LED chip junction temperature will greatly increase, resulting in overheating phenomenon.
Chip junction temperature is too high will make the brightness of LED decreased, resulting in the LED wavelength shift, to some extent reduce the reliability of the LED, many peers such as lamps with high power LED lamp, LED lamp, LED lamp can't effectively solve the problem of heat dissipation, and lead to product quality problems occurred much too little, the problem itself is likely to avoid, but because the manufacturers in the selection of the supplier of the products, the selection of inferior products phenomenon.
In order to increase the heat dissipation area of lamps and lanterns, the structural design of fins with fin. Because LED the heat is generated after passing through the sealing material conduction to the heat sink, and then by the heat sink to the atmosphere. Typically, fin position is vertical, the air convection, so the direction of the vertical fin to. In addition, as the LED volume is relatively small, mainly adopts centralized heat, heat flows from the LED, then we need a good thermal conductivity material is provided on the LED, heat convection between the air and the fin.
Heat sink material is aluminum, the structure is cylindrical, the middle part of the shape of the radiator can be placed circuit without the effect of heat conduction under. Have a direct effect on the performance of heat sink size and thickness of the heat sink and the effective radiating area. The cooling pad with good heat conductivity, heat dissipation fins with gasket and ensure to be able to have a good heat dissipation effect. The size of the heat sink, mainly through the heat sink for calculation of the volume of the decision. The heating power is greater, the greater the volume of the heat sink, so in the design of the heat sink in, to carry on the preliminary design to the occupied volume, and then the design of other parts.
Has a great influence on efficiency of heat sink base thickness on the heat sink, due to heat sink bottom sufficient thickness, can cause the heat goes to all of the fin, the fin good power. But too thick bottom, also can cause the heat accumulation, and reduce the heat conduction function. So the bottom thickness of good design is composed of heat part, thick and gradually to the edge of the thin, so that the heat sink by heat absorbed enough heat to the surrounding the thinner part of the rapid transfer.
In view of the merits of LED energy saving, environmental protection and long service life, taking LED as lighting source has become the new trend of China's lighting field. In order to make the luminous efficiency of LED is higher, need to enter a higher power, and the current high power LED photoelectric conversion efficiency value is only 15% ~ 25% output power into light, other are converted into heat. LED chip has the advantages of small size, poor radiation effect, resulting in high power LED heat use per unit area, even more than IC elements in general is still higher, LED chip junction temperature will greatly increase, resulting in overheating phenomenon.
Chip junction temperature is too high will make the brightness of LED decreased, resulting in the LED wavelength shift, to some extent reduce the reliability of the LED, many peers such as lamps with high power LED lamp, LED lamp, LED lamp can't effectively solve the problem of heat dissipation, and lead to product quality problems occurred much too little, the problem itself is likely to avoid, but because the manufacturers in the selection of the supplier of the products, the selection of inferior products phenomenon.
In order to increase the heat dissipation area of lamps and lanterns, the structural design of fins with fin. Because LED the heat is generated after passing through the sealing material conduction to the heat sink, and then by the heat sink to the atmosphere. Typically, fin position is vertical, the air convection, so the direction of the vertical fin to. In addition, as the LED volume is relatively small, mainly adopts centralized heat, heat flows from the LED, then we need a good thermal conductivity material is provided on the LED, heat convection between the air and the fin.
Heat sink material is aluminum, the structure is cylindrical, the middle part of the shape of the radiator can be placed circuit without the effect of heat conduction under. Have a direct effect on the performance of heat sink size and thickness of the heat sink and the effective radiating area. The cooling pad with good heat conductivity, heat dissipation fins with gasket and ensure to be able to have a good heat dissipation effect. The size of the heat sink, mainly through the heat sink for calculation of the volume of the decision. The heating power is greater, the greater the volume of the heat sink, so in the design of the heat sink in, to carry on the preliminary design to the occupied volume, and then the design of other parts.
Has a great influence on efficiency of heat sink base thickness on the heat sink, due to heat sink bottom sufficient thickness, can cause the heat goes to all of the fin, the fin good power. But too thick bottom, also can cause the heat accumulation, and reduce the heat conduction function. So the bottom thickness of good design is composed of heat part, thick and gradually to the edge of the thin, so that the heat sink by heat absorbed enough heat to the surrounding the thinner part of the rapid transfer.